In microelectromechanical systems (MEMS), microelectronic fabrication techniques have led to mostly planar parts having dimensions in the vertical direction of only a few micrometers. Multi-scale 3-D devices, whose components range in size from several millimeters down to nanometers, are believed by many researchers and practitioners to potentially have a much greater range of applications than MEMS in a wide range of industries including medicine, communications, defense, aerospace, and consumer products. Metrology, manipulation, and testing of these devices have proven to be a significant barrier to their further development. To overcome this barrier, researchers at The Ohio State University have developed a visual sensing method and system that provides the full pose of multiple 3-D micro objects with under 10 nanometer precision in x-y-z. Furthermore, the system can automatically perform positioning and alignment of micro objects in real time using measurements derived from a single image, so that no scanning is necessary to obtain ‘out-of-plane’ motion parameters. Applications include dynamic alignment of micro parts, assembly of micro-optical and micro-mechanical components, and assembly of micro sensors, among others.
- Micro-assembly and manipulation station developers
- Sensor and measurement system manufacturers
- R&D workstation developers
- Provides the full pose of multiple 3-D objects with under 10nm precision in x-y-z
- The six-degree-of-freedom motion of each micro object is measured from a single image so that no scanning is necessary to obtain ‘out-of-plane’ motion parameters
- Allows automatic real-time positioning and alignment of micro-objects
- Can serve as a compact motion sensor and can be employed to achieve direct metrology and direct visual servo control in the object space with nanometer resolution